Invention Grant
- Patent Title: Sputtering target and method for producing same
- Patent Title (中): 溅射靶材及其制造方法
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Application No.: US13579223Application Date: 2011-03-08
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Publication No.: US08968491B2Publication Date: 2015-03-03
- Inventor: Shoubin Zhang , Masahiro Shoji , Yoshinori Shirai
- Applicant: Shoubin Zhang , Masahiro Shoji , Yoshinori Shirai
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Materials Corporation
- Current Assignee: Mitsubishi Materials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Wildman Palmer LLP
- Agent Jeffrey D. Hsi
- Priority: JP2010-063214 20100318; JP2011-036656 20110223
- International Application: PCT/JP2011/001352 WO 20110308
- International Announcement: WO2011/114657 WO 20110922
- Main IPC: C22C9/00
- IPC: C22C9/00 ; C23C14/14 ; C22C1/10 ; C22C32/00 ; C23C14/34 ; C23C14/35 ; H01L31/032 ; B22F3/14

Abstract:
[Problems to be Solved]To provide a sputtering target that is capable of forming a Cu—Ga film to which Na is favorably added by a sputtering method, and a method for producing the same.[Means to Solve the Problems]The sputtering target is provided wherein 20 to 40 at % of Ga, 0.05 to 2 at % of Na, and 0.025 to 1.0 at % of S are contained and a remaining portion has a component composition consisting of Cu and unavoidable impurities. Also, a method for producing the sputtering target includes the step of hot pressing a mixed powder of Na2S powder and Cu—Ga alloy powder or a mixed powder of Na2S powder, Cu—Ga alloy powder, and pure Cu powder in a vacuum atmosphere or an inert gas atmosphere or sintering a mixed powder of Na2S powder and Cu—Ga alloy powder or a mixed powder of Na2S powder, Cu—Ga alloy powder, and pure Cu powder by hot isostatic pressing.
Public/Granted literature
- US08911569B2 Sputtering target and method for producing same Public/Granted day:2014-12-16
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