Invention Grant
US08968514B2 Gas distributing device and substrate processing apparatus including the same
有权
气体分配装置和包括该气体分配装置的基板处理装置
- Patent Title: Gas distributing device and substrate processing apparatus including the same
- Patent Title (中): 气体分配装置和包括该气体分配装置的基板处理装置
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Application No.: US13167287Application Date: 2011-06-23
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Publication No.: US08968514B2Publication Date: 2015-03-03
- Inventor: Jae-Chul Do , Bu-Il Jeon , Myung-Gon Song , Jung-Rak Lee
- Applicant: Jae-Chul Do , Bu-Il Jeon , Myung-Gon Song , Jung-Rak Lee
- Applicant Address: KR
- Assignee: Jusung Engineering Co., Ltd.
- Current Assignee: Jusung Engineering Co., Ltd.
- Current Assignee Address: KR
- Priority: KR10-2010-0059605 20100623
- Main IPC: C23C16/509
- IPC: C23C16/509 ; C23C16/505 ; C23C16/50 ; C23F1/00 ; H01L21/306 ; C23C16/455 ; H01J37/32 ; C23C16/06 ; C23C16/22

Abstract:
A gas distribution device for a substrate treating apparatus includes a plurality of plasma source electrodes having a first side surface; a plurality of plasma ground electrodes having a second side surface facing the first side surface, the plurality of plasma ground electrodes being alternately arranged with the plurality of plasma source electrodes; and a first gas providing part disposed at each plasma source electrode and including a first space, a plurality of first through-holes in communication with the first space for providing a first process gas between one of the plurality of plasma source electrodes and a corresponding ones of the plurality of plasma ground electrodes, and a first discharging portion at the first side surface.
Public/Granted literature
- US20110315320A1 GAS DISTRIBUTING DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME Public/Granted day:2011-12-29
Information query
IPC分类: