Invention Grant
US08968527B2 Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters
有权
微流体喷射装置，用于制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头
- Patent Title: Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters
- Patent Title (中): 微流体喷射装置，用于制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头
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Application No.: US12690955Application Date: 2010-02-16
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Publication No.: US08968527B2Publication Date: 2015-03-03
- Inventor: Yimin Guan , Stuart Jacobsen , Carl Edmond Sullivan
- Applicant: Yimin Guan , Stuart Jacobsen , Carl Edmond Sullivan
- Applicant Address: JP
- Assignee: Funai Electric Co., Ltd
- Current Assignee: Funai Electric Co., Ltd
- Current Assignee Address: JP
- Agency: Amster, Rothstein Ebenstein LLP
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C23C16/00 ; B41J2/14
Abstract:
Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.
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