Invention Grant
- Patent Title: Sputtering target having increased life and sputtering uniformity
- Patent Title (中): 溅射靶材寿命延长和溅射均匀性
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Application No.: US11764772Application Date: 2007-06-18
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Publication No.: US08968536B2Publication Date: 2015-03-03
- Inventor: Adolph Miller Allen , Ki Hwan Yoon , Ted Guo , Hong S. Yang , Sang-Ho Yu
- Applicant: Adolph Miller Allen , Ki Hwan Yoon , Ted Guo , Hong S. Yang , Sang-Ho Yu
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Janah & Associates, P.C.
- Agent Ashok K. Janah
- Main IPC: C23C14/35
- IPC: C23C14/35 ; C23C14/34 ; H01J37/34
Abstract:
A sputtering target for a sputtering chamber comprises a backing plate with a sputtering plate mounted thereon. In one version, the backing plate comprises a circular plate having a front surface comprising an annular groove. The sputtering plate comprises a disk comprising a sputtering surface and a backside surface having a circular ridge that is shaped and sized to fit into the annular groove of the backing plate.
Public/Granted literature
- US20080308416A1 SPUTTERING TARGET HAVING INCREASED LIFE AND SPUTTERING UNIFORMITY Public/Granted day:2008-12-18
Information query
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