Invention Grant
- Patent Title: Method for manufacturing liquid ejection head
- Patent Title (中): 液体喷射头的制造方法
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Application No.: US13953082Application Date: 2013-07-29
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Publication No.: US08968584B2Publication Date: 2015-03-03
- Inventor: Jun Yamamuro , Yoshinori Tagawa , Satoshi Ibe , Hiroto Komiyama , Kouji Hasegawa , Shiro Sujaku
- Applicant: Canon Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2012-194005 20120904
- Main IPC: G01D15/00
- IPC: G01D15/00 ; B41J2/16

Abstract:
A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part.
Public/Granted literature
- US20140061152A1 METHOD FOR MANUFACTURING LIQUID EJECTION HEAD Public/Granted day:2014-03-06
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