Invention Grant
- Patent Title: Radiation-sensitive resin composition and compound
- Patent Title (中): 辐射敏感性树脂组合物和化合物
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Application No.: US13288963Application Date: 2011-11-04
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Publication No.: US08968980B2Publication Date: 2015-03-03
- Inventor: Ken Maruyama , Kota Nishino , Kazuki Kasahara , Hirokazu Sakakibara
- Applicant: Ken Maruyama , Kota Nishino , Kazuki Kasahara , Hirokazu Sakakibara
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-119960 20090518
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; C07C65/10

Abstract:
A radiation-sensitive resin composition includes an acid-dissociable group-containing resin, and a compound shown by the following general formula (1). wherein Z− represents a monovalent anion shown by a general formula (2), M+ represents a monovalent onium cation, R1 represents a linear or branched alkyl group having 1 to 12 carbon atoms substituted or unsubstantiated with a fluorine atom, or a linear or branched alkoxy group having 1 to 12 carbon atoms, and n is 1 or 2.
Public/Granted literature
- US20120045719A1 RADIATION-SENSITIVE RESIN COMPOSITION AND COMPOUND Public/Granted day:2012-02-23
Information query
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