Invention Grant
- Patent Title: Method for manufacturing silicon carbide substrate and method for manufacturing semiconductor device
- Patent Title (中): 碳化硅基板的制造方法及半导体装置的制造方法
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Application No.: US13807197Application Date: 2011-07-06
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Publication No.: US08969103B2Publication Date: 2015-03-03
- Inventor: Makoto Sasaki , Shin Harada , Satomi Itoh , Kyoko Okita
- Applicant: Makoto Sasaki , Shin Harada , Satomi Itoh , Kyoko Okita
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2010-170346 20100729
- International Application: PCT/JP2011/065470 WO 20110706
- International Announcement: WO2012/014645 WO 20120202
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; H01L21/04 ; H01L29/04 ; H01L29/66 ; H01L29/78 ; H01L29/16

Abstract:
A silicon carbide substrate is made of silicon carbide. In the silicon carbide substrate, a normal line of one main surface of the silicon carbide substrate and a normal line of a {03-38} plane form an angle of 0.5° or smaller in an orthogonal projection to a plane including a direction and a direction. In this way, there can be provided the silicon carbide substrate allowing for both improvement of channel mobility of a semiconductor device and stable characteristics thereof.
Public/Granted literature
- US20130109110A1 METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2013-05-02
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