Invention Grant
- Patent Title: Device package and methods for the fabrication thereof
- Patent Title (中): 器件封装及其制造方法
-
Application No.: US13237931Application Date: 2011-09-20
-
Publication No.: US08969132B2Publication Date: 2015-03-03
- Inventor: David William Sherrer , James MacDonald
- Applicant: David William Sherrer , James MacDonald
- Applicant Address: US VA Radford
- Assignee: Nuvotronics, LLC
- Current Assignee: Nuvotronics, LLC
- Current Assignee Address: US VA Radford
- Agency: Dann Dorfman Herrell & Skillman, PC
- Agent Niels Haun
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/047 ; C23C24/08 ; C23C28/04 ; C23C28/00 ; H01L23/06 ; H01L23/24 ; H01L23/00 ; H01Q17/00 ; H01Q23/00
Abstract:
Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an absorbing layer, an EMI blocking layer, a layer comprising conductive material or a metal cover.
Public/Granted literature
- US20120067871A1 Device Package and Methods for the Fabrication Thereof Public/Granted day:2012-03-22
Information query
IPC分类:
