Invention Grant
- Patent Title: Laser ablation tape for solder interconnect formation
- Patent Title (中): 用于焊接互连形成的激光烧蚀带
-
Application No.: US13891279Application Date: 2013-05-10
-
Publication No.: US08969134B2Publication Date: 2015-03-03
- Inventor: Xavier F. Brun , Takashi Kumamoto , Sufi Ahmed
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/00
Abstract:
A tape capable of laser ablation may be used in the formation of microelectronic interconnects, wherein the tape may be attached to bond pads on a microelectronic device and vias may be formed by laser ablation through the tape to expose at least a portion of corresponding bond pads. The microelectronic interconnects may be formed on the bond pads within the vias, such as by solder paste printing and solder reflow. The laser ablation tape can be removed after the formation of the microelectronic interconnects.
Public/Granted literature
- US20140335686A1 LASER ABLATION TAPE FOR SOLDER INTERCONNECT FORMATION Public/Granted day:2014-11-13
Information query
IPC分类:
