Invention Grant
- Patent Title: Semiconductor device and method of assembling same
- Patent Title (中): 半导体装置及其组装方法
-
Application No.: US14077174Application Date: 2013-11-11
-
Publication No.: US08969135B2Publication Date: 2015-03-03
- Inventor: Peng Liu , Qingchun He , Zhaobin Qi , Liqiang Xu , Tong Zhao
- Applicant: Peng Liu , Qingchun He , Zhaobin Qi , Liqiang Xu , Tong Zhao
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Priority: CN201310078670 20130128
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/495 ; H01L25/00
Abstract:
A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a surface of the lead frame. The dam prevents contamination of the down bond area from die attach material, which may occur during a die attach process.
Public/Granted literature
- US20140246767A1 SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME Public/Granted day:2014-09-04
Information query
IPC分类:
