Invention Grant
US08969140B2 Embedded semiconductive chips in reconstituted wafers, and systems containing same
有权
重构晶片中的嵌入式半导体芯片和含有其的系统
- Patent Title: Embedded semiconductive chips in reconstituted wafers, and systems containing same
- Patent Title (中): 重构晶片中的嵌入式半导体芯片和含有其的系统
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Application No.: US13966806Application Date: 2013-08-14
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Publication No.: US08969140B2Publication Date: 2015-03-03
- Inventor: Robert L. Sankman , John S. Guzek
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/02 ; H01L23/522 ; H01L21/683 ; H01L23/538 ; H01L23/64 ; H01L23/00 ; H01L25/16 ; H01L21/50
Abstract:
A reconstituted wafer includes a rigid mass with a flat surface and a base surface disposed parallel planar to the flat surface. A plurality of dice are embedded in the rigid mass. The plurality of dice include terminals that are exposed through coplanar with the flat surface. A process of forming the reconstituted wafer includes removing some of the rigid mass to expose the terminals, while retaining the plurality of dice in the rigid mass. A process of forming an apparatus includes separating one apparatus from the reconstituted wafer.
Public/Granted literature
- US20130328207A1 EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME Public/Granted day:2013-12-12
Information query
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