Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
- Patent Title (中): 阵列基板及其制造方法
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Application No.: US13615661Application Date: 2012-09-14
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Publication No.: US08969146B2Publication Date: 2015-03-03
- Inventor: Yi-Chen Chung , Chia-Yu Chen , Hui-Ling Ku , Yu-Hung Chen , Chi-Wei Chou , Fan-Wei Chang , Hsueh-Hsing Lu , Hung-Che Ting
- Applicant: Yi-Chen Chung , Chia-Yu Chen , Hui-Ling Ku , Yu-Hung Chen , Chi-Wei Chou , Fan-Wei Chang , Hsueh-Hsing Lu , Hung-Che Ting
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW100143536A 20111128; TW101109318A 20120319
- Main IPC: H01L21/84
- IPC: H01L21/84

Abstract:
A manufacturing method of an array substrate includes the following steps. A gate electrode and a gate insulator layer are successively formed on a substrate. A semiconductor layer, an etching stop layer, a hard mask layer, and a second patterned photoresist are successively formed on the gate insulator layer. The second patterned photoresist is employed for performing an over etching process to the hard mask layer to form a patterned hard mask layer. The second patterned photoresist is employed for performing a first etching process to the etching stop layer. The second patterned photoresist is then employed for performing a second etching process to the semiconductor layer to form a patterned semiconductor layer. The etching stop layer uncovered by the patterned hard mask layer is then removed for forming a patterned etching stop layer.
Public/Granted literature
- US20130134425A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-05-30
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