Integrated circuit system employing resistance altering techniques

Invention Grant

US08969151B2 Integrated circuit system employing resistance altering techniques 有权

Title translation: 采用电阻改变技术的集成电路系统

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Patent Title: Integrated circuit system employing resistance altering techniques
Patent Title (中): 采用电阻改变技术的集成电路系统
Application No.: US12040761

Application Date: 2008-02-29
Publication No.: US08969151B2

Publication Date: 2015-03-03
Inventor: Shyue Seng Tan , Lee Wee Teo , Chung Foong Tan , Jae Gon Lee , Elgin Kiok Boone Quek
Applicant: Shyue Seng Tan , Lee Wee Teo , Chung Foong Tan , Jae Gon Lee , Elgin Kiok Boone Quek
Applicant Address: SG Singapore
Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
Current Assignee Address: SG Singapore
Agency: Ishimaru & Associates LLP
Main IPC: H01L21/8234
IPC: H01L21/8234 ; H01L21/8244 ; H01L27/06 ; H01L21/8238 ; H01L29/78 ; H01L21/00

Integrated circuit system employing resistance altering techniques

Abstract:

An integrated circuit system that includes: providing a substrate including a first region and a second region; forming a first device over the first region and a resistance device over the second region; forming a first dielectric layer and a second dielectric layer over the substrate; removing a portion of the second dielectric layer; and annealing the integrated circuit system to remove dopant from the resistance device.

Abstract(Chinese):

一种集成电路系统，包括：提供包括第一区域和第二区域的衬底; 在第一区域上形成第一器件，在第二区域上形成电阻器件; 在所述衬底上形成第一电介质层和第二电介质层; 去除所述第二电介质层的一部分; 并退火集成电路系统以从电阻器件去除掺杂剂。

Public/Granted literature

US20090221117A1 INTEGRATED CIRCUIT SYSTEM EMPLOYING RESISTANCE ALTERING TECHNIQUES Public/Granted day:2009-09-03

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺