Invention Grant
- Patent Title: Semiconductor device and method for fabricating semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14045481Application Date: 2013-10-03
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Publication No.: US08969161B2Publication Date: 2015-03-03
- Inventor: Jae-Han Cha , Kyung-Ho Lee , Sun-Goo Kim , Hyung-Suk Choi , Ju-Ho Kim , Jin-Young Chae , In-Taek Oh
- Applicant: MagnaChip Semiconductor, Ltd.
- Applicant Address: KR Cheongju-si
- Assignee: Magnachip Semiconductor, Ltd.
- Current Assignee: Magnachip Semiconductor, Ltd.
- Current Assignee Address: KR Cheongju-si
- Agency: NSIP Law
- Priority: KR10-2009-0115906 20091127; KR10-2009-0116052 20091127; KR10-2009-0116075 20091127
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L21/8234 ; H01L27/088 ; H01L29/08 ; H01L29/10 ; H01L29/78 ; H01L29/06

Abstract:
A semiconductor device includes: an active region configured over a substrate to include a first conductive-type first deep well and second conductive-type second deep well forming a junction therebetween. A gate electrode extends across the junction and over a portion of first conductive-type first deep well and a portion of the second conductive-type second deep well. A second conductive-type source region is in the first conductive-type first deep well at one side of the gate electrode whereas a second conductive-type drain region is in the second conductive-type second deep well on another side of the gate electrode. A first conductive-type impurity region is in the first conductive-type first deep well surrounding the second conductive-type source region and extending toward the junction so as to partially overlap with the gate electrode and/or partially overlap with the second conductive-type source region.
Public/Granted literature
- US20140030862A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2014-01-30
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