Invention Grant
- Patent Title: Method of fabricating electronic component
- Patent Title (中): 制造电子元器件的方法
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Application No.: US13918002Application Date: 2013-06-14
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Publication No.: US08969173B2Publication Date: 2015-03-03
- Inventor: Yasuyuki Oda , Kaoru Sakinada , Takashi Miyagawa
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2012-137029 20120618; JP2012-231902 20121019
- Main IPC: H01L21/46
- IPC: H01L21/46 ; H01L21/78
Abstract:
A method of fabricating an electronic component includes: mounting a device chip on an upper surface of an insulative substrate; forming a sealing portion that seals the device chip; cutting the insulative substrate and the sealing portion; and forming a plated layer covering the sealing portion by barrel plating.
Public/Granted literature
- US20130337610A1 METHOD OF FABRICATING ELECTRONIC COMPONENT Public/Granted day:2013-12-19
Information query
IPC分类:
