Invention Grant
US08969180B2 Method and system for junction termination in GaN materials using conductivity modulation
有权
使用电导率调制的GaN材料中的结端接方法和系统
- Patent Title: Method and system for junction termination in GaN materials using conductivity modulation
- Patent Title (中): 使用电导率调制的GaN材料中的结端接方法和系统
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Application No.: US14220564Application Date: 2014-03-20
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Publication No.: US08969180B2Publication Date: 2015-03-03
- Inventor: Hui Nie , Andrew P. Edwards , Donald R. Disney , Richard J. Brown , Isik C. Kizilyalli
- Applicant: Avogy, Inc.
- Applicant Address: US CA San Jose
- Assignee: Avogy, Inc.
- Current Assignee: Avogy, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L29/20 ; H01L21/02 ; H01L21/265 ; H01L21/266 ; H01L29/06 ; H01L29/66 ; H01L29/808 ; H01L29/861 ; H01L29/872

Abstract:
A semiconductor structure includes a GaN substrate having a first surface and a second surface opposing the first surface. The GaN substrate is characterized by a first conductivity type and a first dopant concentration. The semiconductor structure also includes a first GaN epitaxial layer of the first conductivity type coupled to the second surface of the GaN substrate and a second GaN epitaxial layer of a second conductivity type coupled to the first GaN epitaxial layer. The second GaN epitaxial layer includes an active device region, a first junction termination region characterized by an implantation region having a first implantation profile, and a second junction termination region characterized by an implantation region having a second implantation profile.
Public/Granted literature
- US20140206179A1 METHOD AND SYSTEM FOR JUNCTION TERMINATION IN GAN MATERIALS USING CONDUCTIVITY MODULATION Public/Granted day:2014-07-24
Information query
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