Invention Grant
- Patent Title: Mechanisms for forming package structure
- Patent Title (中): 形成包装结构的机理
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Application No.: US13943284Application Date: 2013-07-16
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Publication No.: US08969191B2Publication Date: 2015-03-03
- Inventor: Hsien-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/498 ; H01L23/00
Abstract:
Embodiments of mechanisms for forming a package structure are provided. A method for forming a package structure includes providing a semiconductor die and forming a first bump structure and a second bump structure over the semiconductor die. The second bump structure is thinner and wider than the first bump structure. The method also includes providing a substrate having a first contact pad and a second contact pad formed on the substrate. The method further includes forming a first solder paste structure and a second solder paste structure over the first contact pad and the second contact pad, respectively. The second solder paste structure is thicker than the first solder paste structure. In addition, the method includes reflowing the first bump structure and the second bump structure with the first solder paste structure and the second solder paste structure, respectively, to bond the semiconductor die to the substrate.
Public/Granted literature
- US20150021759A1 MECHANISMS FOR FORMING PACKAGE STRUCTURE Public/Granted day:2015-01-22
Information query
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