Invention Grant
- Patent Title: Radiation curable composition
- Patent Title (中): 可辐射固化组合物
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Application No.: US13798598Application Date: 2013-03-13
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Publication No.: US08969457B2Publication Date: 2015-03-03
- Inventor: David Briers
- Applicant: Henkel AG & Co. KGaA
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent Steven C. Bauman
- Priority: EP10186690 20101006
- Main IPC: C08G59/50
- IPC: C08G59/50 ; C09D163/00 ; C08L63/00 ; C08G59/68 ; C08G65/10 ; C08G65/18

Abstract:
The present invention relates to a curable composition, which comprises a) at least one radiation-curable resin, b) at least one specific anti-oxidant and c) at least one photoinitiator salt. The invention further relates to a cured product made from the curable composition. The curable compositions and/or the cured products thereof are particularly suitable as laminating adhesives, sealants, and/or encapsulants for electronic or optoelectronic devices.
Public/Granted literature
- US20130187144A1 RADIATION CURABLE COMPOSITION Public/Granted day:2013-07-25
Information query
IPC分类: