An annular semiconductor element for producing a thermoelectric module includes at least one groove extending in a radial direction from an internal circumferential face to an external circumferential face. An annular insulation material insulates n-doped and p-doped semiconductor elements and is accordingly disposed on a lateral face of the semiconductor elements. The insulation material has a slit which extends in the radial direction and divides the insulation material. A thermoelectric module and a method for manufacturing the thermoelectric module are also provided.