Invention Grant
US08969756B2 Laser cutting system 有权
激光切割系统

Laser cutting system
Abstract:
A workpiece cutting apparatus includes a laser source, a first suction system, and a first finger configured to guide a workpiece as it moves past the laser source. The first finger includes a first end provided adjacent a point where a laser from the laser source cuts the workpiece, and the first end of the first finger includes an aperture in fluid communication with the first suction system.
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