Invention Grant
US08969773B2 CMOS imaging device with three-dimensional architecture having reading circuits and an electronic processing circuit arranged on different substrates
有权
具有三维结构的具有读取电路的CMOS成像装置和布置在不同基板上的电子处理电路
- Patent Title: CMOS imaging device with three-dimensional architecture having reading circuits and an electronic processing circuit arranged on different substrates
- Patent Title (中): 具有三维结构的具有读取电路的CMOS成像装置和布置在不同基板上的电子处理电路
-
Application No.: US13637223Application Date: 2011-03-25
-
Publication No.: US08969773B2Publication Date: 2015-03-03
- Inventor: Arnaud Peizerat , Yvon Cazaux , Michäel Tchagaspanian
- Applicant: Arnaud Peizerat , Yvon Cazaux , Michäel Tchagaspanian
- Applicant Address: FR Paris
- Assignee: Commissariat à l énergie atomque et aux énergies alternatives
- Current Assignee: Commissariat à l énergie atomque et aux énergies alternatives
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1052222 20100326
- International Application: PCT/EP2011/054594 WO 20110325
- International Announcement: WO2011/117376 WO 20110929
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/146

Abstract:
An imaging device including: plural pixels each including a photodetector; plural reading circuits associated with the plural photodetectors, each reading circuit including a first MOS transistor charging/discharging a photodetector and a second MOS transistor converting charges to be output by the photodetector into voltage; an electronic processing circuit configured to process the voltages outputted by the reading circuits; a first substrate on which are formed the pixels and the reading circuits, and a second substrate, distinct from the first substrate, on which is formed the electronic processing circuit, the second substrate being linked electrically to the first substrate by an electrical interconnection forming an electrical link between the reading circuits and the electronic processing circuit.
Public/Granted literature
- US20130048832A1 CMOS IMAGING DEVICE WITH THREE-DIMENSIONAL ARCHITECTURE Public/Granted day:2013-02-28
Information query
IPC分类: