Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing the same, and electronic apparatus having an on-chip micro lens with rectangular shaped convex portions
- Patent Title (中): 固态成像装置及其制造方法以及具有矩形凸部的片上微透镜的电子装置
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Application No.: US13964962Application Date: 2013-08-12
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Publication No.: US08969776B2Publication Date: 2015-03-03
- Inventor: Hiromi Wano , Atsushi Toda , Yoichi Otsuka , Atsushi Yamamoto
- Applicant: Sony Corporation
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2009-088097 20090331
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L31/0232 ; H01L27/146 ; H04N5/225 ; H04N5/3728 ; H04N9/04 ; H01L27/148
Abstract:
A solid-state imaging device includes a light sensing portion which is formed on a substrate and generates a signal electric charge according to incident light; a rectangular or gradient-index on-chip micro lens formed on a light incident side above the light sensing portion; and a planarized lens layer which covers the on-chip micro lens and is formed in such a manner that a light incident surface is planarized.
Public/Granted literature
- US20130327927A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2013-12-12
Information query
IPC分类:
