Invention Grant
- Patent Title: Silicone resin composition, silicone resin sheet, method for producing silicone resin sheet, and optical semiconductor device
- Patent Title (中): 硅树脂组合物，硅树脂片，硅树脂片的制造方法和光半导体装置
-
Application No.: US14186014Application Date: 2014-02-21
-
Publication No.: US08969910B2Publication Date: 2015-03-03
- Inventor: Hiroyuki Katayama
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-160630 20110722
- Main IPC: C08L83/07
- IPC: C08L83/07 ; H01L33/56 ; B32B37/14 ; C09D183/04 ; C08L83/04 ; G02B1/04 ; H01L23/29 ; C08K5/19 ; C08G77/12 ; C08G77/20
Abstract:
A silicone resin composition includes (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule, (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule, (3) a hydrosilylation catalyst, and (4) a curing retarder, wherein the curing retarder contains tetraalkylammonium hydroxide.
Public/Granted literature
Information query
