Invention Grant
US08969913B2 Insulated gate bipolar transistor structure having low substrate leakage
有权
具有低衬底泄漏的绝缘栅双极晶体管结构
- Patent Title: Insulated gate bipolar transistor structure having low substrate leakage
- Patent Title (中): 具有低衬底泄漏的绝缘栅双极晶体管结构
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Application No.: US13673734Application Date: 2012-11-09
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Publication No.: US08969913B2Publication Date: 2015-03-03
- Inventor: Ker Hsiao Huo , Chih-Chang Cheng , Ru-Yi Su , Jen-Hao Yeh , Fu-Chih Yang , Chun Lin Tsai
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Maufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Maufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A high voltage laterally diffused metal-oxide-semiconductor (HV LDMOS) device, particularly an insulated gate bipolar junction transistor (IGBT), and a method of making it are provided in this disclosure. The device includes a semiconductor substrate having at least one highly doped buried portion, a first doped well grown over the substrate, a gate structure formed on the first well, a source and a drain formed on either side of the gate structure, and a second doped well having a U-shaped cross section formed in the first well. A portion of the drain is formed over the first well outside of the second well.
Public/Granted literature
- US20130161689A1 INSULATED GATE BIPOLAR TRANSISTOR STRUCTURE HAVING LOW SUBSTRATE LEAKAGE Public/Granted day:2013-06-27
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