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US08969913B2 Insulated gate bipolar transistor structure having low substrate leakage 有权
具有低衬底泄漏的绝缘栅双极晶体管结构

Insulated gate bipolar transistor structure having low substrate leakage
Abstract:
A high voltage laterally diffused metal-oxide-semiconductor (HV LDMOS) device, particularly an insulated gate bipolar junction transistor (IGBT), and a method of making it are provided in this disclosure. The device includes a semiconductor substrate having at least one highly doped buried portion, a first doped well grown over the substrate, a gate structure formed on the first well, a source and a drain formed on either side of the gate structure, and a second doped well having a U-shaped cross section formed in the first well. A portion of the drain is formed over the first well outside of the second well.
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