Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13788658Application Date: 2013-03-07
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Publication No.: US08969917B2Publication Date: 2015-03-03
- Inventor: Mayumi Morizuka , Yoshiharu Takada
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-074274 20120328
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/772 ; H01L29/36 ; H01L29/778 ; H01L29/812 ; H01L29/40 ; H01L29/20

Abstract:
According to an embodiment, a semiconductor device includes a first layer including a first nitride semiconductor, a second layer provided on the first layer and including a second nitride semiconductor having a wider bandgap than the first nitride semiconductor. The device also includes a source electrode and a drain electrode provided on the second layer; and a gate electrode provided on the second layer and located between the source electrode and the drain electrode. The second layer includes a first region between the gate electrode and the drain electrode, the first region being selectively provided in a surface of the second layer and contains fluorine. A concentration of fluorine in the first region is higher than a concentration of fluorine in a portion underneath the gate electrode in the second layer.
Public/Granted literature
- US20130256753A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2013-10-03
Information query
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