Invention Grant
- Patent Title: Semiconductor device and manufacturing method of semiconductor device
- Patent Title (中): 半导体器件及半导体器件的制造方法
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Application No.: US13302184Application Date: 2011-11-22
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Publication No.: US08969943B2Publication Date: 2015-03-03
- Inventor: Koichi Toba , Yasushi Ishii , Hiraku Chakihara , Kota Funayama , Yoshiyuki Kawashima , Takashi Hashimoto
- Applicant: Koichi Toba , Yasushi Ishii , Hiraku Chakihara , Kota Funayama , Yoshiyuki Kawashima , Takashi Hashimoto
- Applicant Address: JP Kawasaki-shi
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Miles & Stockbridge P.C.
- Priority: JP2010-262394 20101125
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L21/28 ; H01L27/115

Abstract:
A semiconductor device with a nonvolatile memory is provided which has improved characteristics. The semiconductor device includes a control gate electrode, a memory gate electrode disposed adjacent to the control gate electrode, a first insulating film, and a second insulating film including therein a charge storing portion. Among these components, the memory gate electrode is formed of a silicon film including a first silicon region positioned over the second insulating film, and a second silicon region positioned above the first silicon region. The second silicon region contains p-type impurities, and the concentration of p-type impurities of the first silicon region is lower than that of the p-type impurities of the second silicon region.
Public/Granted literature
- US20120132978A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2012-05-31
Information query
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