According to one embodiment, a nonvolatile semiconductor memory device, includes: a stacked body including a plurality of electrode layers stacked alternately with a plurality of insulating films; a plurality of first channel body layers; a memory film; a plurality of selection gates; a second channel body layer connecting to each of the plurality of first channel body layers; a gate insulating film; and a first interconnect electrically connected to at least one of the plurality of electrode layers. The stacked body has a through-hole communicating from the upper surface of the stacked body to the lower surface of the stacked body outside a cell region. And the first interconnect is drawn out through the through-hole from the upper surface side of the stacked body to the lower surface side of the stacked body.