Semiconductor device and methods of manufacturing

Invention Grant

US08969946B2 Semiconductor device and methods of manufacturing 有权

Title translation: 半导体器件及制造方法

Please log in to see more content

Patent Title: Semiconductor device and methods of manufacturing
Patent Title (中): 半导体器件及制造方法
Application No.: US13890081

Application Date: 2013-05-08
Publication No.: US08969946B2

Publication Date: 2015-03-03
Inventor: Pei-Ci Jhang , Zong-Jie Ko , Yumin Lin , Jung-Yu Shieh , Jeng Hwa Liao
Applicant: Macronix International Co., Ltd.
Applicant Address: TW
Assignee: Macronix International Co., Ltd.
Current Assignee: Macronix International Co., Ltd.
Current Assignee Address: TW
Agency: Baker & McKenzie LLP
Main IPC: H01L29/792
IPC: H01L29/792 ; H01L21/28 ; H01L29/66

Semiconductor device and methods of manufacturing

Abstract:

A semiconductor device includes polysilicon layer and a metal silicide layer. The polysilicon layer is doped with carbon or phosphorous. The silicide layer is formed over the polysilicon layer.

Abstract(Chinese):

半导体器件包括多晶硅层和金属硅化物层。多晶硅层掺杂有碳或磷。硅化物层形成在多晶硅层上。

Public/Granted literature

US20140264544A1 SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING Public/Granted day:2014-09-18

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/66	.按半导体器件的类型区分的
H01L29/68	..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的（H01L29/96优先）
H01L29/76	...单极器件
H01L29/772	....场效应晶体管
H01L29/78	.....由绝缘栅产生场效应的
H01L29/792	......带有电荷捕获栅绝缘体，例如MNOS存储晶体管