Invention Grant
- Patent Title: Multi-gate semiconductor devices
- Patent Title (中): 多栅极半导体器件
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Application No.: US12803717Application Date: 2010-07-02
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Publication No.: US08969973B2Publication Date: 2015-03-03
- Inventor: Shinichiro Takatani
- Applicant: Shinichiro Takatani
- Applicant Address: TW Tao Yuan Shien
- Assignee: Win Semiconductors Corp.
- Current Assignee: Win Semiconductors Corp.
- Current Assignee Address: TW Tao Yuan Shien
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/778 ; H01L21/768 ; H01L29/423 ; H01L29/20 ; H01L29/417

Abstract:
A multi-gate semiconductor device with inter-gate conductive regions being connected to balance resistors is provided. The multi-gate semiconductor device comprises a substrate, a multilayer structure formed upon the substrate, a first ohmic electrode, a second ohmic electrode, a plural of gate electrodes, at least one conductive region, and at least one resistive component. When put into practice, the multi-gate semiconductor device is advantageous in reducing the voltage drop along the conductive region with a minimal change in device layout, improving the OFF-state linearity while retaining a low insertion loss, and minimizing the area occupied by the resistor and hence the total chip size.
Public/Granted literature
- US20120001230A1 Multi-gate semiconductor devices Public/Granted day:2012-01-05
Information query
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