Invention Grant
- Patent Title: Vented MEMS apparatus and method of manufacture
- Patent Title (中): 通风MEMS装置及其制造方法
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Application No.: US13623598Application Date: 2012-09-20
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Publication No.: US08969980B2Publication Date: 2015-03-03
- Inventor: Sung Bok Lee
- Applicant: Knowles Electronics, LLC
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: Fitch, Even, Tabin & Flannery LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00 ; H04R19/00 ; H04R19/04

Abstract:
A micro-electromechanical system (MEMS) device includes a housing and a base. The base includes a port opening extending therethrough and the port opening communicates with the external environment. The MEMS die is disposed on the base and over the opening. The MEMS die includes a diaphragm and a back plate and the MEMS die, the base, and the housing form a back volume. At least one vent extends through the MEMS die and not through the diaphragm. The at least one vent communicates with the back volume and the port opening and is configured to allow venting between the back volume and the external environment.
Public/Granted literature
- US20130075836A1 Vented MEMS Apparatus And Method Of Manufacture Public/Granted day:2013-03-28
Information query
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