Invention Grant
- Patent Title: Sensor package
- Patent Title (中): 传感器包装
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Application No.: US14003343Application Date: 2012-02-21
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Publication No.: US08969981B2Publication Date: 2015-03-03
- Inventor: Akinobu Kanai , Yoshitaka Adachi , Masao Shimizu , Junichi Tanaka , Sho Sasaki
- Applicant: Akinobu Kanai , Yoshitaka Adachi , Masao Shimizu , Junichi Tanaka , Sho Sasaki
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Osha Liang LLP
- Priority: JP2011-055972 20110314
- International Application: PCT/JP2012/054082 WO 20120221
- International Announcement: WO2012/124437 WO 20120920
- Main IPC: H01L23/31
- IPC: H01L23/31 ; B81B7/00 ; H01L23/055 ; G01L19/14 ; H01L23/13 ; H01L23/00 ; H01L23/498
Abstract:
A sensor package has a semiconductor sensor chip, and a package body that has a semiconductor sensor chip mounting region on which the semiconductor sensor chip is mounted. The package body being a resin injection molded product. A groove is formed in a rear surface on an opposite side to a surface, on which the semiconductor sensor chip is mounted, so as to surround the semiconductor sensor chip mounting region. A coupling section is formed in the rear surface to couple a resin portion inside the groove and a resin portion outside the groove.
Public/Granted literature
- US20140021565A1 SENSOR PACKAGE Public/Granted day:2014-01-23
Information query
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