Invention Grant
US08969994B2 Method of fabricating a gallium nitride merged P-i-N Schottky (MPS) diode by regrowth and etch back
有权
通过再生长和回蚀刻制造氮化镓合并的P-i-N肖特基(MPS)二极管的方法
- Patent Title: Method of fabricating a gallium nitride merged P-i-N Schottky (MPS) diode by regrowth and etch back
- Patent Title (中): 通过再生长和回蚀刻制造氮化镓合并的P-i-N肖特基(MPS)二极管的方法
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Application No.: US13585121Application Date: 2012-08-14
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Publication No.: US08969994B2Publication Date: 2015-03-03
- Inventor: Madhan M. Raj , Brian Alvarez , David P. Bour , Andrew P. Edwards , Hui Nie , Isik C. Kizilyalli
- Applicant: Madhan M. Raj , Brian Alvarez , David P. Bour , Andrew P. Edwards , Hui Nie , Isik C. Kizilyalli
- Applicant Address: US CA San Jose
- Assignee: Avogy, Inc.
- Current Assignee: Avogy, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L29/47
- IPC: H01L29/47 ; H01L29/15 ; H01L29/861 ; H01L21/36

Abstract:
An MPS diode includes a III-nitride substrate characterized by a first conductivity type and a first dopant concentration and having a first side and a second side. The MPS diode also includes a III-nitride epitaxial structure comprising a first III-nitride epitaxial layer coupled to the first side of the substrate, wherein a region of the first III-nitride epitaxial layer comprises an array of protrusions. The III-nitride epitaxial structure also includes a plurality of III-nitride regions of a second conductivity type, each partially disposed between adjacent protrusions. Each of the plurality of III-nitride regions of the second conductivity type comprises a first section laterally positioned between adjacent protrusions and a second section extending in a direction normal to the first side of the substrate. The MPS diode further includes a first metallic structure electrically coupled to one or more of the protrusions and to one or more of the second sections.
Public/Granted literature
- US20140048902A1 METHOD OF FABRICATING A GALLIUM NITRIDE MERGED P-I-N SCHOTTKY (MPS) DIODE BY REGROWTH AND ETCH BACK Public/Granted day:2014-02-20
Information query
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