Signal transmission arrangement

Invention Grant

US08970000B2 Signal transmission arrangement 有权

Title translation: 信号传输布置

Patent Title: Signal transmission arrangement
Patent Title (中): 信号传输布置
Application No.: US12689086

Application Date: 2010-01-18
Publication No.: US08970000B2

Publication Date: 2015-03-03
Inventor: Martin Kerber , Jens-Peer Stengl , Uwe Wahl
Applicant: Martin Kerber , Jens-Peer Stengl , Uwe Wahl
Applicant Address: AT Villach
Assignee: Infineon Technologies Austria AG
Current Assignee: Infineon Technologies Austria AG
Current Assignee Address: AT Villach
Agency: Slater & Matsil, L.L.P.
Main IPC: H01L21/50
IPC: H01L21/50 ; H02M3/335 ; H01F27/28 ; H01L23/48 ; H01L23/522 ; H01L23/64 ; H01L25/065 ; H01L23/00

Abstract:

A signal transmission arrangement is disclosed. A voltage converter includes a signal transmission arrangement.

Abstract(Chinese):

公开了一种信号传输装置。电压转换器包括信号传输装置。

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/50	...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的