Invention Grant
- Patent Title: MEMS element
- Patent Title (中): MEMS元件
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Application No.: US14021762Application Date: 2013-09-09
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Publication No.: US08970005B2Publication Date: 2015-03-03
- Inventor: Hiroaki Yamazaki
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick PC
- Priority: JP2013-062670 20130325
- Main IPC: H01G5/18
- IPC: H01G5/18

Abstract:
According to one embodiment, there is disclosed a MEMS element. The MEMS element includes a lower electrode having a surface on which a plurality of minute convex portions are formed. A plurality of dielectric bumps are provided on the upper surface of the lower electrode and are thicker than heights of the convex portions. A dielectric layer is provided on the dielectric bumps and the lower electrode. An upper electrode is provided above the dielectric layer. The upper electrode is movable so as to vary capacitance between the upper electrode and the lower electrode.
Public/Granted literature
- US20140284767A1 MEMS ELEMENT Public/Granted day:2014-09-25
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