Invention Grant
- Patent Title: Packages with molding material forming steps
- Patent Title (中): 具有成型材料成型步骤的包装
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Application No.: US13906185Application Date: 2013-05-30
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Publication No.: US08970024B2Publication Date: 2015-03-03
- Inventor: Yu-Chen Hsu , Chun-Hung Lin , Yu-Feng Chen , Han-Ping Pu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/31 ; H01L21/56 ; H01L25/00 ; H01L23/00 ; H01L25/10 ; H01L25/065
Abstract:
A package includes a first package component having a top surface, a second package component bonded to the top surface of the first package component, and a plurality of electrical connectors at the top surface of the first package component. A molding material is over the first package component and molding the second package component therein. The molding material includes a first portion overlapping the second package component, wherein the first portion includes a first top surface, and a second portion encircling the first portion and molding bottom portions of the plurality of electrical connectors therein. The second portion has a second top surface lower than the first top surface.
Public/Granted literature
- US20140264810A1 Packages with Molding Material Forming Steps Public/Granted day:2014-09-18
Information query
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