Invention Grant
- Patent Title: Metallization mixtures and electronic devices
- Patent Title (中): 金属化混合物和电子器件
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Application No.: US13964065Application Date: 2013-08-10
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Publication No.: US08970027B2Publication Date: 2015-03-03
- Inventor: Artur Kolics , Fritz Redeker
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Beyer Law Group LLP
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H05K1/09 ; H01L21/288 ; H01L21/768 ; H01L23/532 ; C23C18/18 ; C25D7/12 ; C25D3/12 ; C25D3/20 ; C25D3/22 ; C25D3/30 ; C25D3/38 ; C25D3/46 ; C25D3/48 ; C25D3/50 ; C25D3/54 ; C25D3/56 ; C25D5/02 ; C25D15/00 ; C23C18/16 ; C23C18/31 ; C23C18/40 ; C23C18/50 ; C23C18/52
Abstract:
One aspect of the present invention is a method of processing a substrate. In one embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electroless deposition solution and electrolessly depositing a metal matrix and co-depositing the metal particles. In another embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electrochemical plating solution and electrochemically plating a metal matrix and co-depositing the metal particles. Another aspect of the present invention is a mixture for the formation of an electrical conductor on or in a substrate. Another aspect of the present invention is an electronic device.
Public/Granted literature
- US20140034370A1 METALLIZATION MIXTURES AND ELECTRONIC DEVICES Public/Granted day:2014-02-06
Information query
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