Invention Grant
US08970028B2 Embedded heat spreader for package with multiple microelectronic elements and face-down connection
有权
嵌入式散热器，用于具有多个微电子元件和面朝下连接的封装
- Patent Title: Embedded heat spreader for package with multiple microelectronic elements and face-down connection
- Patent Title (中): 嵌入式散热器，用于具有多个微电子元件和面朝下连接的封装
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Application No.: US13339595Application Date: 2011-12-29
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Publication No.: US08970028B2Publication Date: 2015-03-03
- Inventor: Wael Zohni
- Applicant: Wael Zohni
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A microelectronic package includes a substrate, first and second microelectronic elements, and a heat spreader. The substrate has terminals thereon configured for electrical connection with a component external to the package. The first microelectronic element is adjacent the substrate and the second microelectronic element is at least partially overlying the first microelectronic element. The heat spreader is sheet-like, separates the first and second microelectronic elements, and includes an aperture. Connections extend through the aperture and electrically couple the second microelectronic element with the substrate.
Public/Granted literature
- US20130168843A1 EMBEDDED HEAT SPREADER FOR PACKAGE WITH MULTIPLE MICROELECTRONIC ELEMENTS AND FACE-DOWN CONNECTION Public/Granted day:2013-07-04
Information query
IPC分类:
