Invention Grant
- Patent Title: Extending metal traces in bump-on-trace structures
- Patent Title (中): 在痕迹结构中扩展金属痕迹
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Application No.: US13035586Application Date: 2011-02-25
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Publication No.: US08970033B2Publication Date: 2015-03-03
- Inventor: Yu-Feng Chen , Yuh Chern Shieh , Tsung-Shu Lin , Han-Ping Pu , Jiun Yi Wu , Tin-Hao Kuo
- Applicant: Yu-Feng Chen , Yuh Chern Shieh , Tsung-Shu Lin , Han-Ping Pu , Jiun Yi Wu , Tin-Hao Kuo
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00
Abstract:
A device includes a work piece, and a metal trace on a surface of the work piece. A Bump-on-Trace (BOT) is formed at the surface of the work piece. The BOT structure includes a metal bump, and a solder bump bonding the metal bump to a portion of the metal trace. The metal trace includes a metal trace extension not covered by the solder bump.
Public/Granted literature
- US20120217632A1 Extending Metal Traces in Bump-on-Trace Structures Public/Granted day:2012-08-30
Information query
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