Invention Grant
US08970037B2 Terminal structure, and semiconductor element and module substrate comprising the same
有权
端子结构，以及包含该端子结构的半导体元件和模块基板
- Patent Title: Terminal structure, and semiconductor element and module substrate comprising the same
- Patent Title (中): 端子结构，以及包含该端子结构的半导体元件和模块基板
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Application No.: US13960291Application Date: 2013-08-06
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Publication No.: US08970037B2Publication Date: 2015-03-03
- Inventor: Kenichi Yoshida , Makoto Orikasa , Hideyuki Seike , Yuhei Horikawa , Hisayuki Abe
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-185031 20120824
- Main IPC: H01L23/485
- IPC: H01L23/485 ; H01L23/492 ; H01L23/00
Abstract:
A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, filling the opening on the electrode; and a dome-shaped bump containing Sn and Ti, covering the under bump metal layer, wherein at least part of the under bump metal layer has a portion sandwiched between the external electrode and the insulating covering layer.
Public/Granted literature
- US20140054769A1 TERMINAL STRUCTURE, AND SEMICONDUCTOR ELEMENT AND MODULE SUBSTRATE COMPRISING THE SAME Public/Granted day:2014-02-27
Information query
IPC分类:
