Invention Grant
- Patent Title: Interconnect structure for high frequency signal transmissions
- Patent Title (中): 高频信号传输的互连结构
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Application No.: US13340764Application Date: 2011-12-30
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Publication No.: US08970048B2Publication Date: 2015-03-03
- Inventor: Masahiro Inohara
- Applicant: Masahiro Inohara
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Main IPC: H01L23/535
- IPC: H01L23/535 ; H01L23/528 ; H01L23/522 ; H01L23/66
Abstract:
A higher aspect ratio for upper level metal interconnects is described for use in higher frequency circuits. Because the skin effect reduces the effective cross-sectional area of conductors at higher frequencies, various approaches are described to reduce the effective RC delay in interconnects.
Public/Granted literature
- US20120104576A1 INTERCONNECT STRUCTURE FOR HIGH FREQUENCY SIGNAL TRANSMISSIONS Public/Granted day:2012-05-03
Information query
IPC分类:
