Invention Grant
US08970053B2 Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM
有权
在第一和第二导电焊盘上焊接焊接的发光二极管的半导体封装至少分开75MU
- Patent Title: Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM
- Patent Title (中): 在第一和第二导电焊盘上焊接焊接的发光二极管的半导体封装至少分开75MU
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Application No.: US13483247Application Date: 2012-05-30
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Publication No.: US08970053B2Publication Date: 2015-03-03
- Inventor: Yuen-Han Wang , Sheng-Li Lu , Jih-Fu Wang , Hsien-Wen Chen , Kuan-Yu Yang
- Applicant: Yuen-Han Wang , Sheng-Li Lu , Jih-Fu Wang , Hsien-Wen Chen , Kuan-Yu Yang
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW101105025A 20120216
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A semiconductor package and a fabrication method thereof are disclosed, which is characterized in that a solder material is used to bond an LED chip and a substrate so as to provide a thick joint between the substrate and the LED chip and hence reduce stresses generated between the LED chip and the substrate due to their CTE mismatch, thereby preventing delamination from occurring between the LED chip and the substrate after a reliability test.
Public/Granted literature
- US20130214310A1 SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF Public/Granted day:2013-08-22
Information query
IPC分类:
