Invention Grant
US08970238B2 Probe module with interleaved serpentine test contacts for electronic device testing
有权
具有交错蛇形测试触点的探头模块，用于电子设备测试
- Patent Title: Probe module with interleaved serpentine test contacts for electronic device testing
- Patent Title (中): 具有交错蛇形测试触点的探头模块，用于电子设备测试
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Application No.: US13163516Application Date: 2011-06-17
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Publication No.: US08970238B2Publication Date: 2015-03-03
- Inventor: Douglas J. Garcia
- Applicant: Douglas J. Garcia
- Applicant Address: US OR Portland
- Assignee: Electro Scientific Industries, Inc.
- Current Assignee: Electro Scientific Industries, Inc.
- Current Assignee Address: US OR Portland
- Agency: Young Basile Hanlon & MacFarlane P.C.
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R1/067 ; G01R3/00 ; G01R31/28
Abstract:
A probe module for testing an electronic device comprises at least two contacts, each contact including a first end portion extending in a first direction along a first line, a second end portion extending linearly in a second direction opposite from the first direction and along a second line, and a third curved portion extending between the first end portion and the second end portion. The first line is spaced apart from and in parallel with the second line, and the at least two contacts are spaced apart from each other in a direction perpendicular to the first line and the second line. Methods for making such a probe module are also taught.
Public/Granted literature
- US20120319712A1 Probe Module With Interleaved Serpentine Test Contacts For Electronic Device Testing Public/Granted day:2012-12-20
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