Invention Grant
US08970246B2 Assembly and circuit structure for measuring current through an integrated circuit module device
有权
用于通过集成电路模块装置测量电流的装配和电路结构
- Patent Title: Assembly and circuit structure for measuring current through an integrated circuit module device
- Patent Title (中): 用于通过集成电路模块装置测量电流的装配和电路结构
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Application No.: US13334676Application Date: 2011-12-22
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Publication No.: US08970246B2Publication Date: 2015-03-03
- Inventor: Christopher D. Hickam
- Applicant: Christopher D. Hickam
- Applicant Address: US IL Peoria
- Assignee: Caterpillar Inc.
- Current Assignee: Caterpillar Inc.
- Current Assignee Address: US IL Peoria
- Agent Uchendu O. Anyaso
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R1/20 ; G01R31/00 ; G01R31/28

Abstract:
An assembly and circuit structure for measuring current through an integrated circuit (IC) module device is disclosed. The circuit structure includes a power supply, at least one IC module device, at least one amplifier, and a resistive washer. The power supply can be configured to generate direct or alternating current. The at least one IC module device having a pair of terminals can be configured to receive the generated current. The at least one amplifier can be configured to measure the amount of current that flows through the IC module device. The at least one amplifier may be electrically coupled to a resistor. Also, a resistive washer may be configured to oppose current flow through the at least one IC module so as to redirect current to flow through the resistor.
Public/Granted literature
- US20120167026A1 ASSEMBLY AND CIRCUIT STRUCTURE FOR MEASURING CURRENT THROUGH AN INTEGRATED CIRCUIT MODULE DEVICE Public/Granted day:2012-06-28
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