Invention Grant
- Patent Title: Chip resistor and manufacturing method thereof
- Patent Title (中): 芯片电阻及其制造方法
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Application No.: US13733349Application Date: 2013-01-03
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Publication No.: US08970340B2Publication Date: 2015-03-03
- Inventor: Torayuki Tsukada , Kentaro Naka
- Applicant: Rohm Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2012-1110 20120106; JP2012-264983 20121204
- Main IPC: H01C1/012
- IPC: H01C1/012 ; H01C17/00 ; H01C1/14 ; G01R1/20 ; H01C1/148 ; G01R3/00

Abstract:
A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.
Public/Granted literature
- US20130187749A1 CHIP RESISTOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-07-25
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