An imaging apparatus includes: an electronic circuit unit (30) including an imaging device (31) to acquire an object image formed by an imaging optical system (20); and a housing member (13) housing the electronic circuit unit (30). The electronic circuit unit (30) includes a thermally-conductive heat transfer member (37) in contact with an outer peripheral surface thereof which is in parallel with a fitting direction of the electronic circuit unit (30) into the housing member (13). The heat transfer member (37) includes a soft material portion (37b) in contact with the outer peripheral surface of the electronic circuit unit (37), and a plate portion (37a) in contact with the soft material portion (37b) and an inner peripheral wall surface of the housing member (13). The soft material portion (37b) is made of a shape-conformable member.