Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13479032Application Date: 2012-05-23
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Publication No.: US08971044B2Publication Date: 2015-03-03
- Inventor: Keiji Okumura , Takukazu Otsuka , Masao Saito
- Applicant: Keiji Okumura , Takukazu Otsuka , Masao Saito
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Fish & Richardson P.C.
- Priority: JP2007-249498 20070926; JP2008-021859 20080131
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L25/18 ; H01L25/16 ; H02M7/00 ; H05K1/14
Abstract:
A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
Public/Granted literature
- US20120229985A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-09-13
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