Invention Grant
US08971421B2 Milli-meter-wave-wireless-interconnect (M2W2-interconnect) method for short-range communications with ultra-high data rate capability
有权
毫米波无线互联（M2W2互连）方法，用于具有超高数据速率能力的短距离通信
- Patent Title: Milli-meter-wave-wireless-interconnect (M2W2-interconnect) method for short-range communications with ultra-high data rate capability
- Patent Title (中): 毫米波无线互联（M2W2互连）方法，用于具有超高数据速率能力的短距离通信
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Application No.: US14456922Application Date: 2014-08-11
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Publication No.: US08971421B2Publication Date: 2015-03-03
- Inventor: Sai-Wang Tam , Mau-Chung F. Chang
- Applicant: The Regents of the University of California
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- Agency: Gates & Cooper LLP
- Main IPC: H04L27/00
- IPC: H04L27/00 ; H04B5/00 ; H04B5/02
Abstract:
A millimeter wave wireless (M2W2) interconnect is used for transmitting and receiving signals at millimeter-wave frequencies for short-range wireless communication with high data rate capability. The transmitter and receiver antennae may comprise an on-chip differential dipole antenna or a bond-wire differential dipole antenna. The bond wire differential dipole antenna is comprised of a pair of bond wires connecting between a pair of pads on an integrated circuit (IC) die and a pair of floating pads on a printed circuit board (PCB).
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