Invention Grant
- Patent Title: Interconnect structure for MEMS device
- Patent Title (中): MEMS器件的互连结构
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Application No.: US13073922Application Date: 2011-03-28
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Publication No.: US08971675B2Publication Date: 2015-03-03
- Inventor: Jon Bradley Lasiter
- Applicant: Jon Bradley Lasiter
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: G02F1/01
- IPC: G02F1/01 ; G02B26/00
Abstract:
An interferometric modulator array is formed with connectors and/or an encapsulation layer with electrical connections. The encapsulation layer hermetically seals the array. Circuitry may also be formed over the array.
Public/Granted literature
- US20110177745A1 INTERCONNECT STRUCTURE FOR MEMS DEVICE Public/Granted day:2011-07-21
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