Invention Grant
- Patent Title: Method of controlling substrate processing apparatus, maintenance method of substrate processing apparatus and transfer method performed in substrate processing apparatus
- Patent Title (中): 基板处理装置的控制方法，基板处理装置的维护方法以及在基板处理装置中进行的转印方法
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Application No.: US14056374Application Date: 2013-10-17
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Publication No.: US08972036B2Publication Date: 2015-03-03
- Inventor: Makoto Nomura
- Applicant: Hitachi Kokusai Electric Inc.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2010-045764 20100302
- Main IPC: G06F19/00
- IPC: G06F19/00 ; B65G25/00 ; H01L21/677 ; G05B15/02 ; G05B19/418 ; H01L21/00
Abstract:
Only a wafer for QC check may be transferred and a production wafer may prevent from being transferred into an assigned process chamber whose QC check is not completed after a maintenance task, and the production wafer may be processed the assigned process chamber after the completion of the QC check. The wafer for QC check is transferred while inhibiting a transfer of the production wafer into the assigned process chamber, and the production wafer is transferred into each of the process chambers of the plurality except the assigned process chamber.
Public/Granted literature
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