Invention Grant
- Patent Title: Superspeed inter-chip interface
- Patent Title (中): 超级片内接口
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Application No.: US13435926Application Date: 2012-03-30
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Publication No.: US08972646B2Publication Date: 2015-03-03
- Inventor: Sridharan Ranganathan , David J. Harriman , Anoop Mukker , Satheesh Chellappan , Karthi R. Vadivelu , Shalini Sharma , Zeeshan Sarwar
- Applicant: Sridharan Ranganathan , David J. Harriman , Anoop Mukker , Satheesh Chellappan , Karthi R. Vadivelu , Shalini Sharma , Zeeshan Sarwar
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: G06F13/14
- IPC: G06F13/14 ; G06F13/40
Abstract:
An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.
Public/Granted literature
- US20130262731A1 SUPERSPEED INTER-CHIP COMMUNICATIONS Public/Granted day:2013-10-03
Information query
